Albicki, A., University of Rochester, NY
Ardalan, S., Pairie View A&M University, Prairie View, TX
Baker, S., Genesis Microchip Inc., Markham, Ontario, Canada
Barby, J., University of Waterloo, Ontario, CA
Boisvert, D.M., East Coast Labs, Salem, NH
Bowman, R., EDX, Fairport, NY
Braverman, D., NEC Electronics, Fairport, NY
Brown, G., Advanced Micro Devices, TX
Brown, G.A., Rochester Institute of Technology, NY
Chang, K.Y., Compass Design Automation, San Jose, CA
Chang, M., Rochester Institute of Technology, NY
Chen, H., IBM, Yorktown Heights, NY
Chen Chi, M., Industrial Technology Research Institute, Hsinshu, Taiwan
Chiang, A., Brooktree Inc., Boulder, CO
Childers, G., Intergraph Electronics, Boulder, CO
Chrusciel, R., ETEC, Inc., West Peabody, MA
Chung, S.S., National Chiao Tung University, Hsinchu, Taiwan
Cook, W., Eastman Kodak Company, Rochester, NY
Criado , A. R., ABB HAFO, Inc., San Diego, CA
Davis, A., Rochester Institute of Technology, NY
Deo, N., Philips Semiconductors, San Jose, CA
Eder, A., FH Augsburg, Augsburg,Germany
England, D., Intel Corporation, Chandler, AZ
Everts, J., Sandia National Laboratories, Albuquerque, NM
Fang, W, Jet Propulsion Laboratories, Pasadena, CA
Fertsch, M., Raytheon Microelectronics, Andover, MA
Gabara , T.J., AT&T Bell Laboratories, Allentown, PA
Gaboury, M., Fisher-Rosemount, Eden Prairie, MN
Gloster, C., North Carolina State University, Raleigh, NC
Greggain, L., Genesis Microchip, Inc., Markham, Ontario, Canada
Hayat, F., Cadence Design Systems, San Jose, CA
Honnenahalli, S., COMPASS Design Automation, San Jose, CA
Hsu, K.W., Rochester Institute of Technology, Rochester, NY
Hsu, Y., IBM, Yorktown Heights, NY
Hsu, Y, University of California at Riverside, Riverside, CA
Hull, R., Xerox Corporation, Webster, NY
Inkol, R. J., Department of National Defense, Ottawa, Ontario, Canada
Issa, S., Oki Semiconductor, Andover, MA
Kedem, G., Duke University, Durham, NC
Kim, C.B., Pacific Communication Science Inc., CA
Ko, U., Texas Instruments, Dallas, TX
Kowalski, J., Jet Propulsion Labs, Pasadena, CA
Lang, M., Xerox Corporation, Rochester, NY
Lee, H., AT&T Bell Labs
Lee,P.P.K., Eastman Kodak Company, Rochester, NY
Lefebvre, M., Carleton University, Ottawa, Canada
Lin, T.T., University of California, San Diego, CA
Lu, S.L., Oregon State University, Corgallis, OR
Makki, R., UNCC, Charlotte, NC
Mallinson, M., Crimble Micro Test, Inc., Billerica,MA
Meyer, D., IBM, Manassas, VA
Munoz, R. , Alcatel Network Systems, Raleigh, NC
Mukund, P.R., Rochester Institute of Technology, NY
Ong, D., Burr-Brown Corp. Tucson, AZ
Ostiguy, D.R., Texas Instruments, Waltham, MA
Paratore, B., Mobile Telesystems Inc, Gaithersburg, MD
Ramsay, F.R., Toshiba America Electronic Components, Sunnyvale, CA
Richards, W.R., MCNC, Research Triangle Park, NC
Robins, G., University of Virginia, Charlotte, VA
Roy, S , TranSwitch Inc., Shelton, CT
Ryan, C., University of Kentucky, Lexington, KY
Schrader, M., Eastman Kodak Company, Rochester, NY
Shastry, N.S., Toshiba Electronic Components, San Jose, CA
Smith, M.J., University of Hawaii, Honolulu, HI
Sridhar, R., SUNY at Buffalo, NY
Stroud, C., University of Kentucky, Lexington, KY
Thompson, D., AT&T Bell Laboratories, Allentown, PA
Traver, C., Union College, Schenectady, NY
Tsai, T., ITRI , Hsinchu, Taiwan
Van Iseghem, K.E., LSI Logic Corporation, Victor, NY
Xiong, X.M., Cadence Design Systems, Inc., San Diego, CA
Yung, Y., National Semiconductor, Santa Clara, CA
Technical Committee Photo(119K image file)
