Techical Program Committee

        Alexander Abicki, University of Rochester
        Michael Alexander, Washington State University 
        Richard Auletta, University of Colorado  
        James Barby, University of Waterloo  
        Elizabeth Brauer, University of Kentucky  
        David Braverman, NEC Electronics  
        Thomas Buechner, IBM-Deutschland  
        Jo Dale Carothers, University of Arizona 
        M. S. Chandrasekhar, Viewlogic Sytems  
        Morris Chang, Illinois Institute of Technology  
        Howard Chen, IBM  
        Mely Chen-Chi, ITRI, Taiwan  
        John Chickanosky, IBM 
        Steve Ciccarelli, ANRO Engineering 
        William Cook, Xerox Corporation 
        Robert Daasch, Portland State University
	T. Raju Damarla, US Army Research Labs  
        Alfred Eder, Fachhochs. Augsburg, Germany 
        David England, Intel Corporation 
        Jeff Everts, Sandia Labs  
        Wai-Chi Fang, Jet Propulsion Laboratory  
        Eby Friedman, University of Rochester 
        Robert. C. Frye, Lucent Bell Labs 
        Thad Gabara, Lucent Bell Labs 
        Michael Gaboury, Rosemount 
        Masao Hotta, Hitachi CRL, Japan 
        Kenneth Hsu, Rochester Institute of Technology 
        Yu-Chin Hsu, University of California 
        Richard Hull, Xerox Corporation 
        Robert Inkol, DREO, Canada 
        Gershon Kedem, Duke University 
        Ramasamy Krishnan, AT&T Wireless Services 
        Robert Landers, Texas Instruments 
        Hyun Lee, Lucent Bell Labs 
        Paul Lee, Eastman Kodak 
        Shih-Lien Lu, Oregon State University 
        Mossaddeq Mahmood, Cadence Design Systems  
        Martin Mallinson, Crimble Micro Test 
        James D. Meindl, Georgia Institute of Technology 
        Vasily Moshnyaga, Kyoto University 
        P.R. Mukund, Rochester Institute of Technology 
        Katsu Nakamura, Analog Devices 
        Sanjiv Narayan, Ambit Systems 
        Sanjay Rajan, Harris Corporation 
        Gabriel Robins, University of Virginia 
        Subhash Roy, TranSwitch Corporation 
        Christopher Ryan, Texas Instruments
	David Sacket, Eastman Kodak 
        Katsuro Sasaki, Hitachi CRL, Japan 
        Mark Schrader, Eastman Kodak 
        Nanjunda Shastry, 3Com Corporation 
        Michael Smith, University of Hawaii 
        Ramalingam Sridhar, SUNY Buffalo 
        Shyang-Tai Su, Hewlett-Packard 
        Mourad Takla, Lucent Bell Labs 
        Cherrice Traver, Union College 
        Kerry Van Iseghem, LSI Logic 
        Yuk Yung, Fujitsu Micro