Techical Program Committee
Alexander Abicki, University of Rochester
Michael Alexander, Washington State University
Richard Auletta, University of Colorado
James Barby, University of Waterloo
Elizabeth Brauer, University of Kentucky
David Braverman, NEC Electronics
Thomas Buechner, IBM-Deutschland
Jo Dale Carothers, University of Arizona
M. S. Chandrasekhar, Viewlogic Sytems
Morris Chang, Illinois Institute of Technology
Howard Chen, IBM
Mely Chen-Chi, ITRI, Taiwan
John Chickanosky, IBM
Steve Ciccarelli, ANRO Engineering
William Cook, Xerox Corporation
Robert Daasch, Portland State University
T. Raju Damarla, US Army Research Labs
Alfred Eder, Fachhochs. Augsburg, Germany
David England, Intel Corporation
Jeff Everts, Sandia Labs
Wai-Chi Fang, Jet Propulsion Laboratory
Eby Friedman, University of Rochester
Robert. C. Frye, Lucent Bell Labs
Thad Gabara, Lucent Bell Labs
Michael Gaboury, Rosemount
Masao Hotta, Hitachi CRL, Japan
Kenneth Hsu, Rochester Institute of Technology
Yu-Chin Hsu, University of California
Richard Hull, Xerox Corporation
Robert Inkol, DREO, Canada
Gershon Kedem, Duke University
Ramasamy Krishnan, AT&T Wireless Services
Robert Landers, Texas Instruments
Hyun Lee, Lucent Bell Labs
Paul Lee, Eastman Kodak
Shih-Lien Lu, Oregon State University
Mossaddeq Mahmood, Cadence Design Systems
Martin Mallinson, Crimble Micro Test
James D. Meindl, Georgia Institute of Technology
Vasily Moshnyaga, Kyoto University
P.R. Mukund, Rochester Institute of Technology
Katsu Nakamura, Analog Devices
Sanjiv Narayan, Ambit Systems
Sanjay Rajan, Harris Corporation
Gabriel Robins, University of Virginia
Subhash Roy, TranSwitch Corporation
Christopher Ryan, Texas Instruments
David Sacket, Eastman Kodak
Katsuro Sasaki, Hitachi CRL, Japan
Mark Schrader, Eastman Kodak
Nanjunda Shastry, 3Com Corporation
Michael Smith, University of Hawaii
Ramalingam Sridhar, SUNY Buffalo
Shyang-Tai Su, Hewlett-Packard
Mourad Takla, Lucent Bell Labs
Cherrice Traver, Union College
Kerry Van Iseghem, LSI Logic
Yuk Yung, Fujitsu Micro