Technical Program Committee:

Tughrul Arslan University of Edinburgh, Scotland, UK       Richard J. Auletta LSI Logic Corporation   Shi-Lien Lu Oregon State University James A. Barby University of Waterloo, Canada   Martin Margala University of Rochester Azeez Bhavnagarwala IBM T.J. Watson Research Center   James Meindl Georgia Institute of Technology Dave Braverman NEC Electronics   Vasily Moshnyaga Fukuoka University, Japan Thomas Büchner IBM Böblingen Development Lab, Germany   Sudhakar Muddu   Sumer Can Maxim Integrated Products   P.R. Mukund Rochester Institute of Technology Jo Dale Carothers University of Arizona   Prawat Nagvajara Drexel University Chien-In Henry Chen Wright State University   Katsu Nakamura Analog Devices, Inc. Howard H. Chen IBM T.J. Watson Research Center   Takao Onoye Kyoto University, Japan Mely Chen Chi ITRI, Taiwan   Fabrice Paillet DGA/DCE/CTA France John Chickanosky IBM Microelectronics   Peter Pirsch University of Hannover, Germany T. Raju Damarla US Army Research Laboratory   Dionisios N. Pnevmatikatos ICS FORTH, Crete, Greece David England Intel Corporation   Gerhard Roos Fujitsu Microelectronics, Germany Eby G. Friedman University of Rochester   Christopher A. Ryan Texas Instruments Dong Ha Virginia Tech   Mark Schrader Eastman Kodak Company Lei He University of Wisconsin   Nanjunda Shastry 3Com Corporation Wolfram Hardt University of Paderborn, Germany   Jerry Sobelman University of Minnesota Masao Hotta Hitachi, Japan   Ramalingam Sridhar SUNY at Buffalo Ken Hsu Rochester Institute of Technology   Mircea Stan University of Virginia Suhwan Kim IBM T.J. Watson Research Center   Myung Hoon Sunwoo Ajou University, Korea Ram K. Krishnamurthy Intel Corporation   Cherrice Traver Union College Hyun Lee Conexant Systems, Inc.   Chih-Kong Ken Yang University of California - Los Angeles Paul Lee Eastman Kodak Company   Yuk Yung Fujitsu Microelectronics