14th Annual IEEE International ASIC/SOC Conference* CALL FOR PAPERS SOC IN A NETWORKED WORLD September 12-15, 2001, Crystal City Hyatt Hotel, Washington, D.C. Sponsored by the IEEE Circuits and Systems Society Driven by the rapid growth of the Internet, communication technologies, pervasive computing, and consumer electronics,Systems-on-Chip (SoC) have started to become a key issue in today's electronic industry. The transition from the traditional Application-Specific Integrated Circuit (ASIC) to SoC has lead to new challenges in Design Methods, Automation, Manufacturing, Technology and Test. The ASIC/SOC Conference provides a forum for sharing recent advances in VLSI/ULSI/GSI technology and design capabilities, and their application to meeting the engineering requirements for ASICs and SoCs. The 2001 Conference will offer three days of technical papers and a full day of technical workshops. The best presented paper will be acknowledged by a Best Paper Award. Papers are invited which address new and previously unpublished developments in the following categories:  SoC Specific Design Methodologies Applications S1 Reusable & Embedded Cores/Macros, Memories A1  Communication, Networking, Internet, e-Business S2 Technology Independent Methodologies A2 Signal/Image Processing S3 On-Chip Buses for SoC A3 Multimedia S4 Smart Sensors Integration A4 Portable & Wireless Systems S5 Library Development A5 Microprocessors, Computers, Pervasive Computing S6 Design of Reconfigurable SoC A6 Consumer and Defense Electronics Common Design Methodologies A7 FPGAs and Reconfigurable SoC D1 High Performance, Low Power Design A8 Other SoC Applications D2 Analog & Mixed-Signal Design Enabling Technologies for SoC D3 Wireless Communications Design T1 Embedded DRAMs/Flash Memories D4 Digital Signal Processing T2 Sensors/MEMS D5 Timing Methodologies, sync./async. design, clocking T3 Deep Sub-micron Technologies, Cu, SiGe, SOI D6 Reconfigurable/Scalable Design T4 Optical Interconnects Design Automation T5 Reconfigurable SoC DA1 System Interconnects, Interconnect Modeling, Signal Integrity Manufacturing DA2 Hardware/Software Co-Design, Verification M1 Signal Integrity & EMI DA3 High Level Design & Synthesis M2 Packaging & I/O Interfacing DA4 Logic Design & Synthesis M3 SoC Testing, Power Measurement, Burn-In DA5 Physical Design & Synthesis, IP Issues and Reuse M4 SoC Fabrication Technologies DA6 SoC Specific CAD Tools Common SoC Issues Verification C1 Project Management, Distributed Development Teams V1 Formal Verification C2 Intellectual Property, Patent and Legal Issues V2 Simulation and Modeling C3 SoC Success Stories, Case Studies V3 Design for Testability, Fault modeling, IDDQ C4 Future SoC Trends and Limits V4 Failure Analysis C5 SoC Overview and Tutorial Papers The paper must clearly state the advances proposed; therefore, sufficient results (measured or simulated) and diagrams must be presented to demonstrate the quality and originality of the contributed work. Submissions should clearly indicate the category (S1…C5; see above), include a 25 word  condensed abstract and a full paper (limited to five double-column IEEE format pages, including figures and references). Proposals for tutorial papers, half-day and full-day tutorials/workshops, and for panel sessions are also invited. Send 3 copies of your paper, along with an electronic version (disk or CD-ROM) in PDF format to: 2000 ASIC/SOC Conference, 101 Lakeforest Blvd., #400-B, Gaithersburg, MD 20877, Fax: 301-527-0994, Email: wendyw@widerkehr.com. For questions on technical issues please contact the appropriate chairperson listed below. DEADLINE FOR SUBMISSION: APRIL 13, 2001 NOTIFICATION OF ACCEPTANCE: MAY 25, 2001 FINAL CAMERA-READY PAPERS DUE: JUNE 30, 2001 For paper submission and updated conference information, please visit our web site at http://asic.union.edu or contact the ASIC/SOC Conference office at 301-527-0900 x104 Conference General Chair Technical Program Chair Steering Committee Chair P. R. Mukund John Chickanosky Thomas Büchner Rochester Institute of Technology IBM Microelectronics IBM Böblingen Lab, Germany prmeee@rit.edu chickano@us.ibm.com tbuechner@de.ibm.com Publications/Publicity Chair Workshop Chair Dong Ha Ram Krishnamurthy Virginia Tech Intel Corporation ha@vt.edu ramk@hf.intel.com *14th Annual IEEE International ASIC Conference Click here for PDF version: