13th Annual IEEE International ASIC/SOC Conference*
CALL FOR PAPERS
SOC IN THE INTERNET AGE
September 13-16, 2000, Washington, D.C.
Co-sponsored by IEEE Circuits and Systems Society and the IEEE Rochester Section
Driven by the rapid growth of the Internet, communication technologies, pervasive computing, and consumer electronics,Systems-on-Chip (SoC) have started to become a key issue in today's electronic industry. The transition from the traditional Application-Specific Integrated Circuit (ASIC) to SoC has lead to new challenges in Design Methods, Automation, Manufacturing, Technology and Test.
The ASIC/SOC Conference provides a forum for sharing recent advances in VLSI/ULSI/GSI technology and design capabilities, and their application to meeting the engineering requirements for ASICs and SoCs. The 2000 Conference will offer three days of technical papers and a full day of technical workshops. The best presented paper will be acknowledged by a Best Paper Award.
Papers are invited which address new and previously unpublished developments in the following categories:
Applications
S1
Reusable & Embedded Cores/Macros, Memories
A1
Communication, Networking, Internet, e-Business
S2
Technology Independent Methodologies
A2
Signal/Image Processing
S3
On-Chip Buses for SoC
A3
Multimedia
S4
Smart Sensors Integration
A4
Portable & Wireless Systems
S5
Library Development
A5
Computers
Common Design Methodologies
A6
Microprocessors, Pervasive Computing
D1
High Performance, Low Power Design
A7
Consumer Electronics
D2
Analog & Mixed-Signal Design
A8
Defense Electronics
D3
Wireless Communications Design
A9
FPGAs
D4
Digital Signal Processing
A10
Other SoC Applications
D5
Timing Methodologies, sync./async. design, clocking
Enabling Technologies for SoC
D6
Reconfigurable/Scalable Design
T1
Embedded DRAMs/Flash Memories
Design Automation
T2
Sensors/MEMS
DA1
System Interconnects, Interconnect Modeling, Signal Integrity
T3
Deep Sub-micron Technologies, Cu, SiGe, SOI
DA2
Hardware/Software Co-Design, Verification
T4
Optical Interconnects
DA3
High Level Design & Synthesis
Manufacturing
DA4
Logic Design & Synthesis
M1
Signal Integrity & EMI
DA5
Physical Design & Synthesis
M2
Packaging & I/O Interfacing
DA6
SoC Specific CAD Tools
M3
SoC Testing, Power Measurement, Burn-In
Verification
M4
SoC Fabrication Technologies
V1
Formal Verification
Common SoC Issues
V2
Simulation and Modeling
C1
Project Management, Distributed Development Teams
V3
Design for Testability, Fault modeling, IDDQ
C2
Intellectual Property, Patent and Legal Issues
V4
Failure Analysis
C3
SoC Success Stories, Case Studies
C4
Future SoC Trends and Limits
The paper must clearly state the advances proposed; therefore, sufficient results (measured or simulated) and diagrams must be presented to demonstrate the quality and originality of the contributed work. Submissions should clearly indicate the category (S1…C4; see above), include a 50 word abstract and a full paper (limited to five double-column IEEE format pages, including figures and references). Proposals for tutorial papers, half-day and full-day tutorials/workshops, and for panel sessions are also invited. Please direct all correspondence to:
2000 ASIC/SOC Conference
101 Lakeforest Blvd., #400-B
Gaithersburg, MD 20877
Fax: 301-527-0994
Email: wendyw@widerkehr.com.
For questions on technical issues please contact the appropriate chairperson listed below.
DEADLINE FOR SUBMISSION: APRIL 17, 2000
NOTIFICATION OF ACCEPTANCE: MAY 25, 2000
FINAL CAMERA-READY PAPERS DUE: JUNE 16, 2000
For paper submission and updated conference information, please visit our web site at
http://asic.union.edu
or contact the ASIC/SOC Conference office at 301-527-0900 x104
*13th Annual IEEE International ASIC Conference
Intel Corporation
IBM Microelectronics
University at Buffalo, SUNY
Ram Krishnamurthy
John Chickanosky
Ramalingam Sridhar
Workshop Chair
Publications/Publicity Chair
Steering Committee Chair
Intel Corporation
University of Arizona
IBM Böblingen Lab, Germany
David England
Jo Dale Carothers
Thomas Büchner
Technical Program Co-Chair
Technical Program Chair
Conference General Chair
For better printing, you might also try the Acrobat version of the Call for Paper: 
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